Circuit Board Repair Guide > Soldering

Chapter 7 - Soldering Procedures

This chapter of the circuit board repair guide includes procedures for soldering a variety of component types including chip components, J lead components and gull wing components.


Solder blends to soldered surfacepad 7.1.1 Quality Soldering Basics
This procedure covers the basic concepts for high quality soldering.

Solder using soldering ironpad 7.1.2 Preparing Circuit Boards and Soldering Tools for Soldering & Component Removal
This procedure covers the basic concepts for preparing circuit boards and soldering tools for soldering and component removal.

Solder joint acceptance criteria for componentspad 7.1.3 Solder Joint Acceptability Criteria for Various Component Types
This document includes figures and tables for solder joint acceptability criteria on a variety of component types.

Soldering through hole componentpad 7.2.1 Soldering Through Hole Components Using a Point to Point Soldering Method
This procedure covers the general guidelines for soldering through hole components using a point to point soldering method.

Man using typical solder fountain systempad 7.2.2 Through Hole Component Soldering Using a Solder Fountain System
This procedure covers the general guidelines for through hole component soldering using a solder fountain system.

Soldering of surface mount chip componentpad 7.3.1 Point to Point Soldering of Surface Mount Chip Components
This procedure covers the general guidelines for point to point soldering of surface mount chip components.

Hot gas soldering of surface mount chip componentpad 7.3.2 Hot Gas Soldering of Surface Mount Chip Components
This procedure covers the general guidelines for hot gas soldering of surface mount chip components.

Point to point soldering of J lead componentpad 7.4.1 Point to Point Soldering of Surface Mount J Lead Components
This procedure covers the general guidelines for point to point soldering of surface mount J lead components.

Continuous flow soldering of J lead componentpad 7.4.2 Continuous Flow Soldering of Surface Mount J Lead Components
This procedure covers the general guidelines for continuous flow soldering of surface mount J lead components.

Hot gas soldering of J lead componentpad 7.4.3 Soldering Surface Mount J lead Components Using Hot Gas
This procedure covers the general guidelines for soldering surface mount J lead components using hot gas.

Point to point soldering of gull wing componentpad 7.5.1 Point to Point Soldering of Surface Mount Gull Wing Components
This procedure covers the general guidelines for point to point soldering of surface mount gull wing components.

Continuous flow soldering of gull wing componentpad 7.5.2 Continuous Flow Soldering of Surface Mount Gull Wing Components
This procedure covers the general guidelines for continuous flow soldering of surface mount gull wing components.

Hot gas soldering of gull wing componentpad 7.5.3 Soldering Surface Mount Gull Wing Components Using Hot Gas
This procedure covers the general guidelines for soldering surface mount gull wing components using hot gas.


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