Circuit Board Repair Guide > Component Removal

Chapter 8 - Component Removal Procedures

The component removal procedures chapter of the circuit board repair guide includes procedures for removing a variety of component types including chip components, J lead components, and gull wing components.


Vacuum desoldering tool used for component removalpad 8.1.1 Through Hole Component Removal Using a Powered Vacuum Desoldering Tool
This procedure covers the general guidelines for through hole component removal using a powered vacuum desoldering tool.

Man using solder fountain system for component removalpad 8.1.2 Through Hole Component Removal Using a Solder Fountain System
This procedure covers the general guidelines for through hole component removal using a solder fountain system.

Forked tip used for chip component removalpad 8.2.1 Forked Tip Method for Chip Component Removal
This procedure covers the forked tip method for chip component removal.

Hot tweezers used for chip component removalpad 8.2.2 Hot Tweezer Method for Chip Component Removal
This procedure covers the hot tweezer method for chip component removal.

Contact method used for J lead component removalpad 8.3.1 Contact Method of J Lead Component Removal
This procedure covers the use of direct contact conduction heating for J lead component removal.

Convection method used for J lead component removalpad 8.3.2 Convection Method of J lead Component Removal
This procedure covers the use of hot gas/air for J lead component removal.

Contact method used for gull wing component removalpad 8.4.1 Contact Method of Gull Wing Component Removal
This procedure covers the use of direct contact conduction heating for gull wing component removal.

Convection method used for gull wing component removalpad 8.4.2 Convection Method of Gull Wing Component Removal
This procedure covers the use of hot gas/air for gull wing component removal.


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