Circuit Bonding System
The Circuit Bonding System is the best, calibrated system
for bonding adhesive film backed circuits and is ideally
suited for bonding small patterns including surface
mount and BGA pads. This bonding press not only gives
the operator better control over the bonding process,
but also ensures optimal adhesion and repeatability.
Includes a built-in calibration slide to maintain a
regulated bonding force depending upon the circuit pattern
size and shape. The digital temperature controller maintains
a uniform temperature throughout the 30-second bonding
The Bonding Tips fit into the hand held Bonding Iron
(part number 115-3102) and the Circuit Bonding System.
The bottom machined surface of each Bonding Tip is used
to apply heat and pressure to bond the adhesive backed
replacement pads, edge contacts, and lands to the circuit