Circuit Board Repair Guide > Conductor Repair Procedures > 4.1.1 How to Rebond a Lifted Conductor Using Liquid Epoxy

How to Rebond a Lifted Conductor Using Liquid Epoxy

Repair Circuit Boards | Repair SMT Pads | Repair BGA Pads | Repair Lands | Repair Edge Contacts
Repair a Conductor | Plated Hole Repair | Base Board Repair | Replace Solder Mask or Coatings

This repair procedure is used to rebond a lifted circuit with liquid circuit board epoxy. Liquid epoxy is inserted under and around the circuit to bond it back down to the printed circuit board surface.

This procedure should not be used to rebond a circuit that has been stretched or damaged.

IPC Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 10.0 Laminate Conditions
Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
CTC 2.7 Epoxy Mixing and Handling
IPC7721 4.1.1 Lifted Conductor Repair, Epoxy Seal

Tools and Materials

Lifted conductor needs to be rebonded
Lifted Conductor
4.1.1 Lifted Conductor Repair, Epoxy Seal Method

Apply epoxy under lifted circuit

Fig. 1: Apply a small amount of
epoxy under the entire length of
the lifted circuit.
Clean the area.
Remove any obstructions that prevent the lifted circuit from making contact with the base board surface.
Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.
3.  Clean the area
4.  Mix the epoxy.
5.  Carefully apply a small amount of epoxy under the entire length of the lifted circuit. The tip of a knife may be used to apply the epoxy. (See Figure 1).
6.  Press the lifted circuit down into the epoxy and into the contact with the base board material.
7.  Apply additional epoxy to the surface of the lifted circuit and to all sides as needed.

Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.
Some components may be sensitive to high temperature.
8.  Apply surface coating to match prior coating as required.
Conductor repair completed

Fig. 2: Conductor repair completed.
1.  Visual examination and tape test per IPC-TM-650 (ANSI/IPC-FC-250A) test method 2.4.1.
2.  Electrical tests as applicable.

Links to Related Products

Circuit board epoxy for ciruit repair  
Circuit Bond Kit 115-1322: Liquid circuit board epoxy
Circuit Bond Kit contains 10 packages of clear, low viscosity, superior strength epoxy ideal for circuit board use. The epoxy is precisely measured out into two-compartment plastic packages. This adhesive is easy to use and there's no measuring.

Color Agents for Circuit Boards
Matching epoxy to the color of the circuit board being repaired is easy when you use a color agent. Color agents may also be applied directly to the circuit board surface for color matching.

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