115-2706 Bonding Film
115-3118 Circuit Bonding System
2.1 Handling Electronic Assemblies
2.2.1 How to Clean a Circuit Board
2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
2.3.2 Coating Removal Using Solvent Method
2.3.3 Coating Removal Using Peeling Method
2.3.4 Coating Removal Using Thermal Method
2.3.5 Coating Removal Using Grinding / Scraping Method
2.3.6 Coating Removal Using Micro Blasting Method
2.4.1 Replace Solder Mask or Coatings on Printed Circuit Boards
2.4.2 Replace Conformal Coatings and Encapsulants on Printed Circuit Boards
2.4.3 Replace Solder Mask or Coatings on Printed Circuit Boards at BGA Locations
2.5 Baking and Preheating of Printed Circuit Boards
2.6.1 Legend Marking Using Stamping Method
2.6.2 Legend Marking Using Hand Lettering Method
2.6.3 Legend Marking Using Stencil Method
2.7 Epoxy Mixing and Handling
3.1 How to Repair Blisters in Circuit Board Base Materials
3.2 How to Reduce the Bow and Twist, or Warping of Circuit Boards
3.3.1 How to Repair Minor Damage to Non-Plated Holes
3.3.2 How to Repair Major Damage to Non-Plated Holes
3.4.1 How to Repair Minor Damage to Key and Slot Openings
3.4.2 How to Repair Major Damage to Key and Slot Openings
3.5.1 How to Repair Minor Damage to Circuit Base Board Material
3.5.2 How to Repair Major Damage to Base Board Areas
3.5.3 Repairing Damaged Base Board Corners and Edges
4.1.1 How to Rebond a Lifted Conductor Using Liquid Epoxy
4.1.2 How to Rebond a Lifted Conductor Using Film Adhesive
4.2.2 How to Repair a Damaged Conductor Using a Foil Jumper & Film Adhesive
4.2.3 How to Repair a Damaged Conductor by Welding
4.2.4 How to Repair a Damaged Conductor Using a Surface Jumper Wire
4.2.5 How to Repair Damaged Conductors Using a Jumper Wire
4.2.6 How to Repair an Inner Layer Conductor
4.2.7 How to Repair a Damaged Surface Conductor Plane
4.3.1 How to Cut Surface Circuits or Conductors
4.3.2 How to Cut Inner Layer Circuits or Conductors
4.3.3 How to Sever Internal Connections at a Plated Through Hole
4.3.4 How to Cut Internal Connections at a Plated Hole
4.4.1 How to Rebond a Lifted Land Using Liquid Epoxy
4.4.2 How to Rebond a Lifted Land Using Film Adhesive
4.5.1 How to Replace Damaged Lands Using Liquid Epoxy
4.5.2 How to Repair Damaged Lands Using Replacement Lands and Film Adhesive
4.6.1 How to Repair Damaged Edge Contacts Using Liquid Adhesive
4.6.2 How to Repair Damaged Edge Contacts Using New Contacts & Film Adhesive
4.6.3 How to Replate Damaged or Solder Contaminated Edge Contacts
4.7.1 How to Repair Damaged Surface Mount Pads Using Liquid Epoxy
4.7.4 Surface Mount, BGA Pad with Integral Via Repair
4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method
5.1 Plated Hole Repair, No Inner Layer Connection
5.2 Plated Hole Repair, Double Wall Method
5.3 Plated Hole Repair, Inner Layer Connection
6.1 How to Use Jumper Wires
6.2.1 Using Jumper Wires, BGA Components, Circuit Track Method
6.2.2 Using Jumper Wires, BGA Components, Through Board Method
6.3 Guidelines for Component Modifications and Additions
6.4 Guidelines for Component Lead Cutting and Lifting
7.1.1 Quality Soldering Basics
7.1.2 Preparing Circuit Boards and Soldering Tools for Soldering & Component Removal
7.1.3 Solder Joint Acceptability Criteria for Various Component Types
7.2.1 Soldering Through Hole Components Using a Point to Point Soldering Method
7.2.2 Through Hole Component Soldering Using a Solder Fountain System
7.3.1 Point to Point Soldering of Surface Mount Chip Components
7.3.2 Hot Gas Soldering of Surface Mount Chip Components
7.4.1 Point to Point Soldering of Surface Mount J Lead Components
7.4.2 Continuous Flow Soldering of Surface Mount J Lead Components
7.4.3 Soldering Surface Mount J lead Components Using Hot Gas
7.5.1 Point to Point Soldering of Surface Mount Gull Wing Components
7.5.2 Continuous Flow Soldering of Surface Mount Gull Wing Components
7.5.3 Soldering Surface Mount Gull Wing Components Using Hot Gas
8.1.1 Through Hole Component Removal Using a Powered Vacuum Desoldering Tool
8.1.2 Through Hole Component Removal Using a Solder Fountain System
8.2.1 Forked Tip Method for Chip Component Removal
8.2.2 Hot Tweezer Method for Chip Component Removal
8.3.1 Contact Method of J Lead Component Removal
8.3.2 Convection Method of J lead Component Removal
8.4.1 Contact Method of Gull Wing Component Removal
8.4.2 Convection Method of Gull Wing Component Removal
9.1.1 Process Flow for BGA Component Rework
9.1.2 Inspection Methods for BGA Components
9.2.1 Development of a BGA Component Rework Profile Using the Standard Method
9.2.2 Development of a BGA Component Rework Profile Using the Smart Track Method
9.3.1 Hot Gas Method for Eutectic Solder Ball BGA Rework
9.4.1 Reballing BGA Components Using Replacement Balls & a Special Fixture
B4-064-1013-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-104-1515-127 Flextac BGA Rework Stencil (Pkg. of 10)
B4-1152-3535-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-196-1515-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-256-1717-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-324-2323-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-456-2323-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-484-2323-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-672-2727-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-676-2727-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-780-2929-100 Flextac BGA Rework Stencil (Pkg. of 10)
B4-783-2929-100 Flextac BGA Rework Stencil (Pkg. of 10)
B6-119-1422-127 Flextac BGA Rework Stencil (Pkg. of 10)
B6-225-2727-150 Flextac BGA Rework Stencil (Pkg. of 10)
B6-256-1717-100 Flextac BGA Rework Stencil (Pkg. of 10)
B6-256-2727-127 Flextac BGA Rework Stencil (Pkg. of 10)
B6-272-2727-127 Flextac BGA Rework Stencil (Pkg. of 10)
B6-292-2727-127 Flextac BGA Rework Stencil (Pkg. of 10)
B6-352-3535-127 Flextac BGA Rework Stencil (Pkg. of 10)
B6-357-2525-127 Flextac BGA Rework Stencil (Pkg. of 10)
B6-388-3535-127 Flextac BGA Rework Stencil (Pkg. of 10)
B6-432-4040-127 Flextac BGA Rework Stencil (Pkg. of 10)
B6-560-4242-127 Flextac BGA Rework Stencil (Pkg. of 10)
B6-676-2727-100 Flextac BGA Rework Stencil (Pkg. of 10)
B8-256-2121-127 Flextac BGA Rework Stencil (Pkg. of 10)
B8-304-2125-127 Flextac BGA Rework Stencil (Pkg. of 10)
B8-361-2525-127 Flextac BGA Rework Stencil (Pkg. of 10)
B8-625-3232-127 Flextac BGA Rework Stencil (Pkg. of 10)
Base Board Repair
Base Board Repair Kit
Base Board Repair Products
Basic Circuit Board Repair Procedures
BGA Component Rework Procedures
BGA Pad Repair
BGA Stencils
Bonding Iron and Bonding Tips
CBLANKAS Circuit Frame, Blank, Tin Plated
CC035080AG Circuit Frame, Contacts .035" x .080"
CC038255AG Circuit Frame, Contacts .038" x .250"
CC050060AG Circuit Frame, Contacts .050"/.060"
CC050300AG Circuit Frame, Contacts .050" x .300"
CC070080AG Circuit Frame, Contacts .070"/.080"
CC076190AG Circuit Frame, Contacts .076" x .190"
CC085360AG Circuit Frame, Contacts .085" x .360"
CC090300AG Circuit Frame, Contacts .090" x .300"
CFV001S Circuit Frame, Variety, Tin Plated
CFV002AS Circuit Frame, Variety, Tin Plated
CFV003AS Circuit Frame, Variety, Tin Plated
Chip Scale (QFN) Prototyping Boards from Schmartboard
Circuit Board Epoxy
Circuit Board Eyelets
Circuit Board Repair Guide
Circuit Board Repair Kits
Circuit Frames
Coating Removal
Color Agents for Circuit Boards
Component Removal
Conductor Repair
Conductor Repair Procedures
Conductor Repair Products
Copyright Notice and Disclaimer
CP050060AS Circuit Frame, Lands .050"/.060", Tin Plated
CP067267AS Circuit Frame, Lands .067" x .267", Tin Plated
CP070080AS Circuit Frame, Lands .070"/.080", Tin Plated
CP090100AS Circuit Frame, Lands .090"/.100" Diameter, Tin Plated
CP090100BS Circuit Frame, Lands .090" x .100", Tin Plated
CP140210AS Circuit Frame, Lands .140"ID x .210"OD, Tin Plated
CP156097AS Circuit Frame, Lands .156"OD x .097"ID, Tin Plated
CP250125AS Circuit Frame, Lands .250"OD x .125"ID, Tin Plated
CS004085AS Circuit Frame, Surface Mount Pads .004" x .085"
CS010012AS Circuit Frame, BGA Pads .010"/.012", Tin Plated
CS011061AS Circuit Frame, Surface Mount Pads .011" x .061"
CS012060AS Circuit Frame, Surface Mount Pads .012" x .060"
CS012100AS Circuit Frame, Surface Mount Pads .012" x .100"
CS015020AS Circuit Frame, BGA Pads .015" x .020", Tin Plated
CS020020AS Circuit Frame, BGA Pads .020" Diameter, Tin Plated
CS020025AS Circuit Frame, BGA Pads .020"/.025", Tin Plated
CS020028AS Circuit Frame, Surface Mount Pads .020" x .028"
CS025035AS Circuit Frame, BGA Pads .025" x .035", Tin Plated
CS025080AS Circuit Frame, Surface Mount Pads .025" x .080"
CS025080BS Circuit Frame, Surface Mount Pads .025" x .080"
CS026026AG Circuit Frame, BGA Pads .026" Diameter, .003" Track
CS028185AS Circuit Frame, Surface Mount Pads .028" x .185"
CS030055AS Circuit Frame, Surface Mount Pads .030" x .055"
CS034030AS Circuit Frame, Surface Mount Pads .034" x .030"
CS038090AS Circuit Frame, Surface Mount Pads .038" x .090"
CS039039AS Circuit Frame, Surface Mount Pads .039" x .039"
CS040070AS Circuit Frame, Surface Mount Pads .040" x .070"
CS040110AS Circuit Frame, Surface Mount Pads .040" x .110"
CS045110AS Circuit Frame, Surface Mount Pads .045" x .110"
CS046106AS Circuit Frame, Surface Mount Pads .046" x .106"
CS048068AS Circuit Frame, Surface Mount Pads .048" x .068"
CS050050AS Circuit Frame, Surface Mount Pads .050" x .050"
CS051063AS Circuit Frame, BGA Pads .051"/.063" dia., Tin Plated
CS051087AS Circuit Frame, Surface Mount Pads .051" x .087"
CS060080AS Circuit Frame, Surface Mount Pads .060" x .080"
CS065055AS Circuit Frame, Surface Mount Pads .065" x .055"
CS065095AS Circuit Frame, Surface Mount Pads .065" x .095"
CS067173AS Circuit Frame, Surface Mount Pads .067" x .173"
CS071106AS Circuit Frame, Surface Mount Pads .071" x .106"
CS090100AS Circuit Frame, Surface Mount Pads .090" x .100"
CS092092AS Circuit Frame, BGA Pads .092" Diameter, Tin Plated
CS095000AS Circuit Frame, Surface Mount Pads .095" Diameter
CS095095AS Circuit Frame, Surface Mount Pads .095" x .095"
CS130177AS Circuit Frame, Surface Mount Pads .130" x .177"
CSV002AS Circuit Frame, Surface Mount Pads .100" x .100", Tin Plated
CSVAR03AS Circuit Frame, Variety, Surface Mount, Tin Plated
CSVAR1AS Circuit Frame, Surface Mount Pads Variety
CT006015AS Circuit Frame, Conductor .006"/.015", Tin Plated
CT006025AS Circuit Frame, Conductor .006"/.025", Tin Plated
CVAR0001AS Circuit Frame, Variety, Tin Plated
Development Boards from Schmartboard
Discrete Surface Mount Prototyping Boards from Schmartboard
EIA Capacitance Code
Eyelet Press
Flextac Wire Dots
Foreword
Gold Contact Repair Kit
High Temperature Tape Discs: 235-3025, 235-3050
Jumper Wires and Component Modification Procedures
Jumpers, Cables and Headers for Circuit Prototyping from Schmartboard
Mechanical Bridge for Schmartboard Circuit Boards
Micro Drill
Multi Component SMT Parts Kits
NPO Capacitor Kit 0402
NPO Capacitor Kit 0603
NPO Capacitor Kit 0805
PCB Tracks
Plated Hole Repair
Plated Hole Repair Kit
Plated Hole Repair Products
PLCC Prototyping Boards from Schmartboard
Power Modules - SchmartModules from Schmartboard
Professional Repair Kit
Prototyping Boards
Prototyping Boards for SMT Connectors from Schmartboard
QFP Prototyping Boards from Schmartboard
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SMT Component Storage
SMT Pad Repair
SMT Parts Kit Engineers
SMT Parts Kit Students
SMT Resistor Kit 0402
SMT Resistor Kit 0603
SMT Resistor Kit 0805
SMT Zener Diode Kit
SOIC Prototyping Boards from Schmartboard
Soldering
Surface Mount Capacitor Kits
Surface Mount Resistor Kits
Surface Mount Zener Diode Kits
Tantalum Chip Capacitor Kit
Through Hole Prototyping Boards from Schmartboard
X7R Capacitor Kit 0603
X7R Capacitor Kit 0805
X7R/X5R Capacitor Kit 0402