Circuit Board Repair Guide > Basic Circuit Board Repair Procedures > 2.7 Epoxy Mixing and Handling

Epoxy Mixing and Handling

Repair Circuit Boards | Repair SMT Pads | Repair BGA Pads | Repair Lands | Repair Edge Contacts
Repair a Conductor | Plated Hole Repair | Base Board Repair | Replace Solder Mask or Coatings

This section covers epoxy mixing and handling. The epoxy used in this procedure has multiple uses including solder mask repair, base board repair, circuitry over-coating and delamination repair.

For high strength or high temperature applications two part epoxies will generally have the best properties.

Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
CTC 2.5 Baking and Preheating of Printed Circuit Boards
IPC 7721 2.7 Epoxy Mixing and Handling

Tools and Materials
Color Agents
Foam Swabs
Heat Lamp
Mixing Cups
Mixing Sticks

Epoxy (Circuit Bond) Specifications - No. 115-3302
The Epoxy referenced in this procedure has the following properties.
Packaging 2 gram pre-measured packages
Color Clear, transparent
Pot life 30 minutes
Cure cycle 24 hours at room temperature or 4 hours @ 149F (65C)
Viscosity (after mixing) 2000 cps
Operating temperature range -67F to 275F (-55C to 135C)
Hardness 88 Shore D
Dielectric strength 410 volts/mil
Shelf life 6 months minimum

PC Board Preparation
The area where the epoxy is to be applied should be prepared prior to mixing the epoxy. This preparation may include preheating the affected area to improve absorption of the applied epoxy. The entire circuit board may also be heated in an oven or with a heat lamp.

Some components may be sensitive to high temperatures.

Procedure - Prepackaged Two Part Circuit Board Epoxy

Prepackaged two part circuit board epoxy

Figure 1: For prepackaged two part circuit board epoxy, remove divider clip and mix resin and hardener inside package.

Apply epoxy as needed

Figure 2: Apply epoxy as needed. Foam swabs may be used to add texture for solder mask repair.
Remove the clip separating the resin and hardener. Mix by squeezing both halves together with your fingers. Mix for at least one minute to ensure a complete mix of the resin and activator. (See Figure 1).
Cut open one end of the epoxy tube and squeeze the contents into a mixing cup. Mix again with a mixing stick to ensure a thorough mixture of the resin and hardener.

For bubble free epoxy, remove the clip separating the resin and hardener. Cut open one end of the Epoxy tube and squeeze the contents into a mixing cup. Slowly stir the mixture with the mixing stick. Be sure to stir the mixture for at least 2 minutes to ensure that all the resin and hardener have completely mixed.

If needed, add color agent to the mixed epoxy. Stir slowly to prevent bubbles.
Apply or use as needed. (See Figure 2).
Cure the epoxy for 24 hours at room temperature or 4 hours @ 149F (65C).
Visual examination of epoxy for texture and color match.
Testing of epoxy surface for complete cure.
Electrical tests as applicable.

Links to Related Products

Circuit board epoxy for ciruit repair  
Circuit Bond Kit 115-1322: Liquid circuit board epoxy
Circuit Bond Kit contains 10 packages of clear, low viscosity, superior strength epoxy ideal for circuit board use. The epoxy is precisely measured out into two-compartment plastic packages. This adhesive is easy to use and there's no measuring.

Color Agents for Circuit Boards
Matching epoxy to the color of the circuit board being repaired is easy when you use a color agent. Color agents may also be applied directly to the circuit board surface for color matching.

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