Circuit Board Repair Guide > Conductor Repair Procedures

Chapter 4 - Conductor Repair Procedures

The conductor repair procedures chapter of the circuit board repair guide covers repair and rework of conductors including circuits, lands, gold contacts, surface mount pads, and BGA pads. See Conductor repair products.


Lifted conductor needs repairpad4.1.1 How to Rebond a Lifted Conductor Using Liquid Epoxy
This repair procedure is used to rebond a lifted circuit with liquid epoxy. Liquid epoxy is inserted under and around the circuit to bond it back down to the printed circuit board surface.

Lifted conductor needs repairpad4.1.2 How to Rebond a Lifted Conductor Using Film Adhesive
This procedure is used to repair damaged and lifted conductors with film adhesive. Dry film epoxy is used to rebond the lifted conductor.

Damaged conductor needs replacementpad4.2.1 How to Repair a Damaged Conductor Using a Foil Jumper
This procedure is used on printed circuit boards to replace damaged or missing circuits on the printed circuit board surface using a foil jumper bonded with liquid epoxy.

Damaged conductor needs replacementpad4.2.2 How to Repair a Damaged Conductor Using a Foil Jumper & Film Adhesive
This procedure is used to replace damaged or missing circuits on the printed circuit board surface using a foil jumper bonded with film adhesive.

Repair short breaks or opens in circuitspad 4.2.3 How to Repair a Damaged Conductor by Welding
This method is used to repair short breaks or opens in circuits on printed circuit boards. A parallel gap welder is used to weld a jumper ribbon across the damaged conductor.

Repair damaged conductor using surface wirepad 4.2.4 How to Repair a Damaged Conductor Using a Surface Jumper Wire
This procedure is used on printed circuit boards to replace damaged or missing circuits on the PC board surface. A length of standard insulated or non insulated wire is used to repair the damaged circuit.

Repair damaged conductor using through board wirepad 4.2.5 How to Repair Damaged Conductors Using a Jumper Wire
This procedure is used on printed circuit boards to replace damaged or missing circuits on the printed circuit board surface. A length of standard insulated or non insulated wire is used to repair the damaged circuit.

Damaged inner layer conductor needs replacementpad 4.2.6 How to Repair an Inner Layer Conductor
This advanced procedure is used to replace damaged or missing circuits on internal layers of multilayer circuit boards.

Damged surface conductor plane needs repairpad 4.2.7 How to Repair a Damaged Surface Conductor Plane
This advanced procedure is used to repair damaged circuit surface planes. The damaged areas are repaired with dry film epoxy, adhesive backed copper foil disks. They are bonded to the circuit board surface using a circuit bonding system or bonding iron.

Sever a circuit or shortpad 4.3.1 How to Cut Surface Circuits or Conductors
This procedure is used to sever a circuit or short. A Surgical Knife or Micro Drill System is used.

Inner layer circuit needs to be cutpad 4.3.2 How to Cut Inner Layer Circuits or Conductors
This procedure is used to sever a circuit or short. A Precision Drill System is used with a carbide end mill.

Inner layer connection at plated hole needs deletionpad 4.3.3 How to Sever Internal Connections at a Plated Through Hole
This procedure is used on multilayer circuit boards or circuit board assemblies to disconnect an internal connection at a plated hole. The Precision Drill System is used with a carbide drill, end mill or ball mill to drill out the hole. The hole may then be filled with epoxy and re-drilled to the diameter needed.

Disconnect internal connection, spoke cutpad 4.3.4 How to Cut Internal Connections at a Plated Hole
This procedure is used on multilayer circuit boards or assemblies to disconnect an internal connection at a plated hole. A precision drill press is used with a carbide end mill to make precise cuts at the spokes or internal circuits extending from the hole.

Lifted land needs repairpad 4.4.1 How to Rebond a Lifted Land Using Liquid Epoxy
This procedure is used to rebond a lifted land using liquid epoxy. Liquid epoxy is inserted under and around the land to bond it back down to the printed circuit board surface.

Lifted land needs repairpad 4.4.2 How to Rebond a Lifted Land Using Film Adhesive
This procedure is used to repair damaged and lifted lands using film adhesive. The lifted lands are repaired with dry film epoxy. They are re-bonded to the printed circuit board surface using a circuit bonding system or bonding iron.

Damaged land needs repairpad 4.5.1 How to Replace Damaged Lands Using Liquid Epoxy
This procedure is used to replace damaged and lifted lands using liquid epoxy. The damaged lands are replaced with new lands.

Damaged land needs repairpad 4.5.2 How to Repair Damaged Lands Using Replacement Lands & Film Adhesive
This procedure is used to replace damaged and lifted lands. The damaged lands are replaced with new dry film, adhesive backed lands. The new lands are bonded to the printed circuit board surface using a circuit bonding system or bonding iron.

Damaged edge contact needs repairpad 4.6.1 How to Repair Damaged Edge Contacts Using Liquid Adhesive
This procedure is used to replace a damaged edge contact with a new edge contact which is bonded to the printed circuit board surface using liquid epoxy.

Damaged edge contact needs repairpad 4.6.2 How to Repair Damaged Edge Contacts Using New Contacts & Film Adhesive
This procedure is used to replace a damaged edge contact with a new edge contact which is bonded with film adhesive. The new edge contact has a dry-film adhesive backing and is bonded to the circuit board surface using a bonding iron or circuit bonding system.

Contaminated gold edge contacts need repairpad 4.6.3 How to Replate Damaged or Solder Contaminated Edge Contacts
This procedure is used to replate edge contacts by selective swab plating. Edge contacts may require replating if they become contaminated with solder or are scratched during handling.

Damaged surface mount pad needs repairpad 4.7.1 How to Repair Damaged Surface Mount Pads Using Liquid Epoxy
This procedure is used to replace damaged surface mount pads with commercially available replacement pads using liquid epoxy.

Damaged surface mount pad needs repairpad 4.7.2 How to Repair Damaged SMT Pads Using New Pads & Film Adhesive
This procedure is used to replace damaged surface mount pads with new dry film, adhesive backed pads. The new pads are bonded to the printed circuit board surface using a specially designed circuit bonding system or bonding iron.

Damaged BGA pad needs repairpad 4.7.3 How to Repair Damaged BGA Pads Using New Pads & Film Adhesive
This procedure is used to replace damaged BGA pads with new dry film, adhesive backed pads. The new pads are bonded to the printed circuit board surface using a specially designed circuit bonding system or bonding iron.

Damaged BGA pad needs repairpad 4.7.4 Surface Mount, BGA Pad with Integral Via Repair
This procedure is used to replace damaged BGA pads with dry film adhesive backed pads. The new pads are bonded to the circuit board surface using a specially designed circuit bonding system or bonding iron. Electrical connection is made to a via which is originally manufactured integral to the pad.

Damaged BGA pad needs repairpad 4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method
This procedure is used to replace damaged BGA pads with new dry film adhesive backed pads. The new pads are bonded to the circuit board surface using a specially designed bonding press or bonding iron. Electrical connection is made to a via circuit which is originally manufactured integral to the pads.


Copyright and Disclaimer Notice Copyright CircuitMedic, Haverhill, MA 01835 USA

Related Items
Professional Repair Kit | Circuit Board Epoxy | Prototyping Boards | Surface Mount Resistor Kits | Surface Mount Capacitor Kits