Circuit Board Repair Guide > Basic Circuit Board Repair Procedures > 2.3.3 Coating Removal Using Peeling Method

Coating Removal Using Peeling Method

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This coating removal method can be used only under special circumstances. Normally the peeling method is used to remove RTV silicone or other thick rubbery-like coating materials.

The coating material is removed using a dull knife or otherwise dull blade to slit the coating material and to peel it off the printed circuit board or printed circuit board assembly.

To determine the appropriate coating removal procedure the coating must first be identified. Refer to procedure number 2.3.1. Coating Removal, Identification of Coatings.

This method is limited to coatings that are rubbery in nature to allow the coating material to be slit into small sections and peeled off the printed board assembly.
Coating removal required at outlined area
Coating Removal Required
At Outlined Area

IPC Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 10.0 Laminate Conditions
Related Procedure References
CTC 1.0 Foreword - Circuit Board Repair Guide
CTC 2.1 Handling Electronic Assemblies
CTC 2.2.1 How to Clean a Circuit Board
CTC 2.4.1 Replace Solder Mask or Coatings on Printed Circuit Boards
CTC 2.4.2 Replace Conformal Coatings and Encapsulants on Printed Circuit Boards
IPC 7721 2.3.3 Coating Removal, Peeling Method

Tools and Materials
Heated Blade or Thermal Parting Tool
Wood Sticks  

2.3.3 Coating Removal, Peeling Method

Printed Board Type: R/F/W/C  |  Skill Level: Advanced  |  Conformance Level: High  |  Rev.: E  |  Rev. Date: Jul 7, 2000

Peel off coating using knife or heated blade

Fig. 1: Slit and peel off coating
using a knife or heated blade.

1.  Slit and peel off the coating material with a dull knife or heated dull blade. (See Figure 1).
2. Repeat as needed until the required material is removed.
Coating removal complete

Fig. 2: Coating removal complete.
1.  Visual examination or UV light may be used to verify complete removal of coating

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