|Circuit Board Repair Guide > Conductor Repair Procedures > SMT Pad Repair > 115-3118 Circuit Bonding System|
115-3118 Circuit Bonding System
• Replacing damaged surface mount pads. How to repair damaged SMT pads using new pads and film adhesive.
• Replacing damaged BGA pads. How to repair damaged BGA pads using new pads and film adhesive.
• Replacing damaged lands. How to repair damaged lands using replacement lands and film adhesive.
• Replacing damaged gold contacts. How to repair damaged edge contacts using new contacts and film adhesive.
Bonding Tips fit into the hand held Bonding Iron (part no. 115-3102 for 120 VAC and part no. 115-3103 for 230 VAC) and the Circuit Bonding System (part no. 115-3118 which includes voltage converter for 120 VAC and 220 VAC). The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond the adhesive backed replacement pads, edge contacts, and lands to the circuit board surface. All our Bonding Tips are machined from high grade aluminum.
ELAB (Engineering Lab) FOB Shipping Point: Haverhill, MA 01835 USA
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