Process Flow for BGA Component Rework
process flow for BGA component rework.
Ball Grid Array Rework
Printed Board Type: R/F/W/C | Skill Level: Advanced |
Conformance Level: High
This document has been prepared by Circuit Technology Center,
Inc. The purpose is to ensure repeatable, high quality rework
of BGA components, and to assure conformity to the highest industry
standards and specifications.
covers procedure and guidelines specific to BGA component rework
conducted by the staff at Circuit Technology Center, Inc. Organizations
using this information may need to make modifications, or other
changes, to accommodate their own particular needs.
- Receiving and Price Quoting
Upon arrival, each BGA
component rework project will be reviewed by the Circuit
Technology Center Sales Department. Personnel will refer
to BGA Rework Process Worksheets when evaluating potential
BGA rework projects. Only appropriate scheduling personnel
are authorized to schedule a completion date.
- Repeat Projects
If the BGA component rework project
appears to be one that has been processed before, it should
be checked in the BGA Rework Process Worksheets. If the
BGA component will require reballing, or if the BGA component
site will require modification, or repair, appropriate scheduling
adjustment may be required. Sales Department personnel will
inform Production Manager about any complexities to assure
- New Projects
For all new projects the circuit board(s)
and BGA component(s) must be evaluated according to the
BGA Rework Process Worksheet. New BGA component rework projects
require the following items to develop a proper rework profile.
(1) Assembled profile circuit board.
(3) Profile components
for each BGA component rework location.
must be made aware of the necessity of these profile boards
and components. In most cases it will be impossible to proceed
without these items. If these items are not available, BGA
rework projects must be reviewed on a case by case basis.
Much of our current profiling is done using
the AirVac Smart Trac System. This profiling system eliminates
the necessity of drilling into the board substrate in order
to collect temperature data. However, one to three reflow
cycles will be needed to determine the proper profile of
the component location.
an appropriate profile circuit board is not available, the
actual circuit board may be exposed to multiple reflow cycles
to determine the proper reflow cycle. These multiple reflow
cycles may degrade overall reliability.
- BGA Process Worksheets
Fill out the required information.
If unsure whether the board has been worked on previously,
see the past
BGA Rework Process Worksheets. Note: Access to BGA Process
Worksheets requires a password.
If all items are
present, work with the appropriate scheduling authority
for a schedule date. If any of the items are missing, discuss
the shortage with the Sales Department and notify customer
Once the BGA rework project has been
quoted it should be forwarded to Customer Service for order
entry and customer approval. If there are any outstanding
issues including: ordering stencils, nozzles, or reballing,
ensure that the BGA Rework Department is notified as soon
as the order is approved.
coding BGA projects use only the approved codes.
- BGA Rework Process Worksheets
The continual changing
of board/component part numbers makes it difficult to determine
whether a particular circuit board and component location
has previously been reworked. Refer to
BGA Rework Process Worksheets before beginning each
repeat project. Note: Access to BGA Process Worksheets requires
After each BGA rework project has logged
and quoted, it will be staged as follows:
Orders - Deliver directly to the BGA rework area with appropriate
labels. Loose boards with parts will be loaded into racks
marked "Incoming". Small boxes with parts will
be brought to the rack marked "Incoming Boxes".
Large Orders - Deliver to incoming holding area
- Initial Inspection
When starting a new BGA rework
project personnel should consider the following:
- Verify circuit board and component part numbers
and quantities against the customer packing slip and
Circuit Technology Center sales order.
- Determine the correct nozzle, stencil, and rework
- Ensure circuit board will fit on the base of the
BGA rework machine. Oversized boards may require special
- Visually inspect circuit boards for temperature
sensitive components or parts. (Fiber optics, plastic
connectors, batteries, etc.)
- Review BGA Machine Preventive Maintenance Schedule.
Ensure the appropriate checks are done prior to operating
BGA rework machines.
- BGA Component Handling
When starting a new BGA rework
project personnel should consider the following: BGA components
may be sensitive to moisture. If BGA parts are not received
in sealed packages, those BGA parts must be baked as follows:
- Remove BGA components from packaging.
- Place BGA components into a labeled tray. Tray must
be labeled with Customer Name, Sales Order No., Baking
- Bake BGA components at 125° C for 24 hours.
- After baking allow parts to cool to room temperature
and immediately place into sealed moisture barrier bags.
Bags must be labeled with Customer Name and Sales Order
number. Bags must be placed into desiccant chamber.
BGA Rework Processing
- Initial Review/Disassembly
Operators should initially
review all paperwork. Assess circuit boards to determine
need for any disassembly or component masking. If disassembly
is needed all materials must be labeled and instructions
written to ensure that materials are replaced after
- BGA Machine Inspection
The following should be
checked prior to starting:
- Appropriate Nozzle Installed
- Rework Profile Available
- Proper Input Air Pressure
If this is the first piece in a larger order it
may require formal First Piece Inspection. See the
Production Manager or Inspection for guidance.
- Reflow Profile - Existing
Use the designated
reflow profile if available. If the reflow profile
is not available on the particular BGA rework machine
the profile may be transferred from another machine.
- Reflow Profile - Creation
Each unique rework
profile includes a removal cycle, placement cycle,
and site cleaning cycle. Refer to the following
procedures for details: 9.2.1 BGA Component Rework
Profile Development, Standard Method; 9.2.2 BGA
Component Rework Profile Development, Smart Track
Method If no profile is available, an existing profile
that closely matches the component and board size,
may be used. All parties must be aware of the inherent
risk in using common profiles.
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