Circuit Board Repair Guide > Basic Circuit Board Repair Procedures

Chapter 2 - Basic Circuit Board Repair Procedures

The basic circuit board repair procedures chapter of the Circuit Board Repair Guide covers handling, cleaning, coatings, legend, and use of epoxies.


Hand holding electronic assemblypad2.1 Proper Methods for Handling Electronic Assemblies
This section covers the proper methods for handling printed circuit boards and printed circuit board assemblies.

pad2.2.1 How to Clean a Circuit Board
This section covers the cleaning methods for printed circuit boards and printed circuit board assemblies.

pad2.2.2 Cleaning Circuit Boards, Aqueous Batch Process
This section outlines a batch cleaning process for removal of small volumes of fluxes and other contaminants that may contact printed circuit boards during circuit board repair and rework operations.

Grinding and scraping to remove coatingspad2.3.1 Coating Removal, Identification of Coating
This section covers the techniques for identifying various circuit board coatings so the appropriate coating removal procedure can be used.

Using solvent to remove surface coatingspad2.3.2 Coating Removal Using Solvent Method
This coating removal method which uses a solvent to remove surface coatings can be used for spot or overall coating removal of conformal coatings or solder resists.

Peeling method used for coating removalpad2.3.3 Coating Removal Using Peeling Method
This coating removal method can be used only under special circumstances. Normally the peeling method is used to remove RTV silicone or other thick rubbery-like coating materials.

Heating method used for removing thick coatingspad2.3.4 Coating Removal Using Thermal Method
This procedure for coating removal uses a controlled, low temperature, localized heating method for removing thick coatings by an overcuring or softening means.

Grinding and scraping to remove coatingspad2.3.5 Coating Removal Using Grinding/Scraping Method
This coating removal procedure covers the use of various grinding and scraping tools to remove coatings.

Coating removal using micro abrasive blasting systempad2.3.6 Coating Removal Using Micro Blasting Method
This method of coating removal uses a micro abrasive blasting system and a very fine soft abrasive powder.

Replace solder mask or coatings on circuit boardspad2.4.1 Replace Solder Mask or Coatings on Printed Circuit Boards
This procedure is used to replace solder mask or coatings on printed circuit boards.

Replace conformal coatings and encapsulants on circuit boardspad2.4.2 Replace Conformal Coatings and Encapsulants on Printed Circuit Boards
This coating replacement procedure is used to replace conformal coatings and encapsulants on printed circuit boards.

Replace solder mask or coatings at BGA locationspad2.4.3 Replace Solder Mask or Coatings on Printed Circuit Boards at BGA Locations
This coating replacement procedure is used to replace solder mask or coatings on printed circuit boards at BGA locations.

Baking and preheating of circuit boardspad2.5 Baking and Preheating of Printed Circuit Boards
This section covers baking and preheating of printed circuit boards and printed circuit board assemblies to prepare the product for subsequent operations.

Stamping method to replace legend and markingspad2.6.1 Legend Marking Using Stamping Method
The stamping method can be used to add, change or replace legend and markings on printed circuit boards or printed circuit board assemblies. This procedure uses epoxy ink and an ink stamp to place the legends on the printed circuit board surface in much the same manner as taking a "finger print".

Hand lettering method  to replace legend and markingspad2.6.2 Legend Marking Using Hand Lettering Method
The hand lettering method can be used to add, change or replace legend and markings on printed circuit boards or printed circuit board assemblies. This procedure uses epoxy ink and a pen to hand letter the legends on the printed circuit board surface.

Stencil method to replace legend and markingspad2.6.3 Legend Marking Using Stencil Method
The stencil method can be used to add, change or replace legend and markings on printed circuit boards or printed circuit board assemblies. This procedure uses epoxy ink and a brush or roller technique. A stencil is used to outline the characters.

Apply epoxy as neededpad2.7 Epoxy Mixing and Handling
This section covers epoxy mixing and handling. The epoxy used in this procedure has multiple uses including solder mask repair, base board repair, circuitry over-coating and delamination repair.


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