Circuit Board Repair Guide > Base Board Repair

Chapter 3 - Base Board Repair Procedures

The base board repair procedures chapter of the circuit board repair guide covers repair of delamination, warp, key slots, non plated holes, surface defects, and various defects to base board material. See Base board repair products.


Delamination blister in base board needs repairpad3.1 How to Repair Blisters in Circuit Board Base Materials
This procedure is used to repair mechanical or thermal blisters or delaminations in circuit board laminated base materials. The blister is then sealed by injecting a low viscosity epoxy into the blister/delamination void.

Bow and twist in circuit board needs repairpad3.2 How to Reduce the Bow and Twist, or Warping of Circuit Boards
This method is used to eliminate, or reduce the bow and twist, or warping of circuit boards.

Damaged hole in base board needs repairpad3.3.1 How to Repair Minor Damage to Non-Plated Holes
This procedure is used to repair cosmetic defects or minor damage to an unsupported tooling or mounting hole. This repair procedure uses high strength epoxy to restore the damaged surface surrounding the hole.

Non plated damaged hole in base board needs repairpad3.3.2 How to Repair Major Damage to Non-Plated Holes
This repair procedure is used to repair severe damage to a hole or to modify the size, shape or location of an unsupported tooling or mounting hole.

Damaged key slot in base board needs repairpad3.4.1 How to Repair Minor Damage to Key and Slot Openings
This repair procedure is used to repair minor damage to a key slot, or other cutout in a printed circuit board or printed circuit board assembly. The damaged area is repaired using high strength epoxy.

Damaged key slot in base board needs repairpad3.4.2 How to Repair Major Damage to Key and Slot Openings
This repair procedure is used to modify or repair a key slot, or other cutout in a printed circuit board or printed circuit board assembly.

Apply epoxy to repair base boardpad3.5.1 How to Repair Minor Damage to Circuit Base Board Material
This procedure covers the repair of minor damage to circuit base board material. Scrapes and scratches in the base board material could be caused by accidents during handling. Burns in the base board material could be caused by improper use of soldering and desoldering tools.

Damaged base board material needs repairpad3.5.2 How to Repair Major Damage to Base Board Areas
This repair procedure is used to repair mechanical or thermal damage to circuit board base material. This procedure is used when extended areas of base material must be completely replaced.

Damaged base board edge needs repairpad3.5.3 Repairing Damaged Base Board Corners and Edges
This method is used to repair mechanical or thermal damage to circuit board base material. This procedure is used when extended areas of base material must be completely replaced.


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